Parameters |
Factory Lead Time |
1 Week |
Package / Case |
525-FBGA, FCBGA |
Operating Temperature |
-40°C~105°C |
Packaging |
Tray |
Published |
2002 |
Series |
QorIQ® Layerscape |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
600MHz |
Core Processor |
ARM® Cortex®-A7 |
Ethernet |
GbE (2) |
Number of Cores/Bus Width |
2 Core 32-Bit |
RAM Controllers |
DDR3L, DDR4 |
USB |
USB 2.0 (1) |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
Secure Boot, TrustZone® |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
LS1022AXN7EKB Overview
Since the microprocessor is packed in 525-FBGA, FCBGA, shipping overseas is convenient. Advanced packaging method Tray is used to provide high reliability. 2 Core 32-Bit cores/Bus width are present in the CPU. The operating temperature around -40°C~105°C should be understood. This is a member of the QorIQ? Layerscape series. The CPU is cored by a processor with a number of 0 cores. It has DDR3L, DDR4 RAM controllers.
LS1022AXN7EKB Features
ARM? Cortex?-A7 Core
LS1022AXN7EKB Applications
There are a lot of NXP USA Inc. LS1022AXN7EKB Microprocessor applications.
- 3D printers
- Scanners
- Information appliances (networking of household appliances)
- Digital set-top boxes
- Mobile computers
- 8. Navigation control field
- Network application field
- Medical instruments chromatographs
- Magnetic resonance imaging (MRI)
- Safety -airbags, automatic braking system (ABS)