Parameters |
Factory Lead Time |
1 Week |
Package / Case |
780-FBGA, FCBGA |
Operating Temperature |
-40°C~105°C |
Packaging |
Tray |
Published |
2016 |
Series |
QorIQ® Layerscape |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
1.6GHz |
Core Processor |
ARM® Cortex®-A72 |
Ethernet |
10GbE (2), 2.5GbE (1), 1GbE (4) |
Number of Cores/Bus Width |
2 Core 64-Bit |
RAM Controllers |
DDR4 |
USB |
USB 3.0 (3) + PHY |
Security Features |
Secure Boot, TrustZone® |
SATA |
SATA 6Gbps (1) |
RoHS Status |
ROHS3 Compliant |
LS1026AXE8Q1A Overview
With a packing size of 780-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. The packaging method Tray provides high reliability. This CPU has 2 Core 64-Bit cores and 2 Core 64-Bit bus widths. Identify the operating temperature around -40°C~105°C. From the QorIQ? Layerscape series. This CPU is cored with a ARM? Cortex?-A72 processor. A total of DDR4 RAM controllers are used by this CPU.
LS1026AXE8Q1A Features
ARM? Cortex?-A72 Core
LS1026AXE8Q1A Applications
There are a lot of NXP USA Inc. LS1026AXE8Q1A Microprocessor applications.
- Robotic prosthetic limbs
- Kindle
- Blenders
- Computer/laptop
- Keyboards
- Network application field
- Television
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Gas monitoring systems
- Xbox