Parameters |
Package / Case |
448-FBGA Exposed Pad |
Supplier Device Package |
448-PBGA w/Heat Spreader (23x23) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Series |
QorlQ LS1 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
650MHz |
Core Processor |
ARM1136JF-S |
Ethernet |
GbE (2) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2 |
USB |
USB 2.0 + PHY (1) |
Additional Interfaces |
I2C, PCIe, PCM/TDM, SPI, UART |
RoHS Status |
ROHS3 Compliant |
LS102MASE7BFA Overview
The microprocessor is conveniently packaged in 448-FBGA Exposed Pad, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 2 Core 32-Bit cores/bus width on the CPU. Be aware of the operating temperature around 0°C~70°C TA. The QorlQ LS1 series contains it. With a core count of ARM1136JF-S, this CPU is multicore. It has DDR2 RAM controllers. To serve better this microprocessor features I2C, PCIe, PCM/TDM, SPI, UART interfaces. Suppliers offer 448-PBGA w/Heat Spreader (23x23) packages.
LS102MASE7BFA Features
ARM1136JF-S Core
LS102MASE7BFA Applications
There are a lot of NXP USA Inc. LS102MASE7BFA Microprocessor applications.
- Smartphone
- Smart highways (navigation, traffic control, information monitoring and car service)
- DDC control
- Set-top boxes
- Robots
- Agriculture, transportation field
- Laminators
- Calculator
- Equipment control
- Tape drives