Parameters |
Factory Lead Time |
1 Week |
Package / Case |
448-FBGA Exposed Pad |
Supplier Device Package |
448-PBGA w/Heat Spreader (23x23) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Published |
2014 |
Series |
QorlQ LS1 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
650MHz |
Core Processor |
ARM1136JF-S |
Ethernet |
GbE (2) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2 |
USB |
USB 2.0 + PHY (1) |
Additional Interfaces |
I2C, PCIe, PCM/TDM, SPI, UART |
RoHS Status |
ROHS3 Compliant |
LS102MASN7BFA Overview
The microprocessor is convenient for international shipping since it is packaged in 448-FBGA Exposed Pad. Using advanced packaging techniques Tray, high reliability is ensured. CPUs have 2 Core 32-Bit cores/bus width. The operating temperature around 0°C~70°C TA should be understood. This is part of the QorlQ LS1 series. The CPU is cored with a ARM1136JF-S processor. There are DDR2 RAM controllers used by this CPU. Microprocessors with I2C, PCIe, PCM/TDM, SPI, UART interfaces are designed to serve users better. A supplier offers a 448-PBGA w/Heat Spreader (23x23) package.
LS102MASN7BFA Features
ARM1136JF-S Core
LS102MASN7BFA Applications
There are a lot of NXP USA Inc. LS102MASN7BFA Microprocessor applications.
- Computer/laptop
- Kindle
- Washing machines
- Scanners
- Mobile computers
- Automatic staplers
- Switches
- 3D printers
- Electromechanical control
- Wastewater treatment