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LTM8068IY

TIN-LEAD SNPB BGA 2.8VIN TO 40VI


  • Manufacturer: Linear Technology/Analog Devices
  • Nocochips NO: 471-LTM8068IY
  • Package: 38-BBGA Module
  • Datasheet: PDF
  • Stock: 887
  • Description: TIN-LEAD SNPB BGA 2.8VIN TO 40VI(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status PRODUCTION (Last Updated: 3 weeks ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 38-BBGA Module
Number of Pins 38
Operating Temperature -40°C~125°C
Packaging Tray
Published 2016
Series µModule®
Size / Dimension 0.44Lx0.35W x 0.19 H 11.3mmx9.0mmx4.9mm
JESD-609 Code e0
Feature UVLO
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 38
Type Isolated Module
Terminal Finish TIN LEAD
Applications ITE (Commercial)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 38
Number of Outputs 2
Voltage - Isolation 2kV
Voltage - Input (Max) 40V
Max Output Current 450mA
Voltage - Output 1 2.5V~18V
Voltage - Input (Min) 2.8V
Current - Output (Max) 450mA 300mA
Voltage - Output 2 1.2V~18V
Control Mode CURRENT-MODE
Height 4.826mm
Width 9mm
RoHS Status Non-RoHS Compliant
See Relate Datesheet

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