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LTN20069

HEAT SINK BGA/PGA 16.5X16.5X8.9


  • Manufacturer: Wakefield-Vette
  • Nocochips NO: 869-LTN20069
  • Package: BGA
  • Datasheet: PDF
  • Stock: 842
  • Description: HEAT SINK BGA/PGA 16.5X16.5X8.9 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Adhesive
Package / Case BGA
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Packaging Box
Published 2007
Series Penguin
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Board Level
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.350 8.89mm
Thermal Resistance @ Forced Air Flow 8.00°C/W @ 500 LFM
Height 8.89mm
Length 0.650 16.51mm
Width 0.653 16.59mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet

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