Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Adhesive |
Package / Case | BGA |
Material | Aluminum |
Shape | Square, Fins |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Material Finish | Black Anodized |
Packaging | Box |
Published | 2007 |
Series | Penguin |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Type | Board Level |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height Off Base (Height of Fin) | 0.350 8.89mm |
Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 500 LFM |
Height | 8.89mm |
Length | 0.650 16.51mm |
Width | 0.653 16.59mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |