M2S005-1VF256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 161 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 161 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 161 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 5K Logic Modules |
| Number of Logic Cells | 6060 |
| Flash Size | 128KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.According to the manufacturer, this system on a chip has a package of 256-LFBGA.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.One important thing to mark down is that this SoC meaning combines FPGA - 5K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 161 inputs and outputs.It is advised to utilize a 1.2V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.It is really beneficial to have system on a chip since there are 256 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip with 161 outputs is available.There is 1.2V power supply required for system on chip.On the SoC chip, there are 161 inputs available for use.Logic system on chips features 6060 logic cells.A flashing 128KB appears on it.Additionally, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005-1VF256I System On Chip (SoC) applications.
- Functional safety for critical applications in the automotive
- Optical drive
- String inverter
- External USB hard disk/SSD
- Wireless networking
- Networked Media Encode/Decode
- Special Issue Editors
- Cyberphysical system-on-chip
- Digital Signal Processing
- Fitness
