M2S005-VF256
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 161 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 161 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 161 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 5K Logic Modules |
| Number of Logic Cells | 6060 |
| Flash Size | 128KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 256-LFBGA package as per the manufacturer's specifications.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.One important thing to mark down is that this SoC meaning combines FPGA - 5K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.An integral part of this SoC consists of a total of 161 I/Os.Use a power supply with a voltage of 1.2V if possible.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.The system on a chip uses 256 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.The SoC chip that comes with this module can be configured to have 161 outputs.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 161 inputs is available to the user.Logic system on chips features 6060 logic cells.A 128KB flash can be seen on it.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005-VF256 System On Chip (SoC) applications.
- Industrial automation devices
- Remote control
- Industrial sectors
- Vending machines
- Central alarm system
- Samsung galaxy gear
- Central alarm system
- Automotive
- Industrial transport
- Healthcare
