M2S005S-1VF256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 161 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 161 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 161 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 5K Logic Modules |
| Number of Logic Cells | 6060 |
| Flash Size | 128KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 256-LFBGA by its manufacturer for this system on a chip.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.In addition, this SoC security combines FPGA - 5K Logic Modules.An advanced Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 161.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.It can feed on a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.Having 256 terminations in total makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.The SoC chip that comes with this module can be configured to have 161 outputs.There is 1.2V power supply requirement for this system on chip SoC.On the SoC chip, there are 161 inputs available for use.Logic system on chips consist of 6060 logic cells.The flash is set to 128KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005S-1VF256I System On Chip (SoC) applications.
- Automotive
- AC-input BLDC motor drive
- ARM support modules
- PC peripherals
- Smartphone accessories
- USB hard disk enclosure
- Digital Media
- Mouse
- Published Paper
- Industrial automation devices
