M2S005S-VF256
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 161 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 161 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 161 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 5K Logic Modules |
| Number of Logic Cells | 6060 |
| Flash Size | 128KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 256-LFBGA package as per the manufacturer's specifications.A 64KB RAM SoC chip provides reliable performance to users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 5K Logic Modules is important.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 161.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.In total, there are 256 terminations, which makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.In order for this SoC chip to work properly, you can have 161 outputs.There is 1.2V power supply required for system on chip.A SoC chip with 161 inputs is available.Logic system on chips features 6060 logic cells.This flash has a size of 128KB.Aside from that, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005S-VF256 System On Chip (SoC) applications.
- Video Imaging
- Efficient hardware for inference of neural networks
- DC-input BLDC motor drive
- Embedded systems
- System-on-chip (SoC)
- Microcontroller based SoC ( RISC-V, ARM)
- Wireless networking
- Digital Media
- Deep learning hardware
- AC-input BLDC motor drive
