Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
400-LFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
400 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B400 |
Number of Outputs |
171 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
169 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
171 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 5K Logic Modules |
Number of Logic Cells |
6060 |
Flash Size |
128KB |
Height Seated (Max) |
1.51mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 400-LFBGA package.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 5K Logic Modules.Tray package houses this SoC system on a chip.169 I/Os are included in this SoC part.Ideally, a power supply with a voltage of 1.2V should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.As a result, there are 400 terminations in total, which does really benefit system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There are 171 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.The SoC chip is equipped with 171 inputs.The logic SoC features 6060 logic cells.This flash has a size of 128KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
There are a lot of Microsemi Corporation
M2S005S-VF400 System On Chip (SoC) applications.
- Medical
- Sports
- Digital Signal Processing
- ARM
- Avionics
- Cyber security for critical applications in the aerospace
- Print Special Issue Flyer
- Automotive
- Smart appliances
- Communication network-on-Chip (cNoC)