banner_page

M2S010-1FGG484I

-40°C~100°C TJ M2S010 System On ChipSmartFusion?2 Series 233 I/O


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S010-1FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 150
  • Description: -40°C~100°C TJ M2S010 System On ChipSmartFusion?2 Series 233 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 166MHz
Base Part Number M2S010
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 233
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 10K Logic Modules
Flash Size 256KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.Manufacturer assigns package 484-BGA to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.Taking note of the fact that this SoC security combines FPGA - 10K Logic Modules is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 233 I/Os.The flash is set to 256KB.By searching M2S010, you can find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.The SoC meaning is based on the core architecture of ARM.It is just enough to start the SoC computing at -40°C.This SoC system on chip is designed to operate at a temperature of 100°C.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S010-1FGG484I System On Chip (SoC) applications.

  • Industrial sectors
  • AC drive control module
  • Industrial automation devices
  • Smart appliances
  • Industrial automation devices
  • sequence controllers
  • Industrial
  • ARM support modules
  • Cyber security for critical applications in the aerospace
  • Samsung galaxy gear

Write a review

Note: HTML is not translated!
    Bad           Good