M2S010-1VFG256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 256-LBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 138 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 138 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 138 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 10K Logic Modules |
| Number of Logic Cells | 12084 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.It is important to note that this SoC security combines FPGA - 10K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part contains a total of 138 I/Os in total.Ideally, a power supply with a voltage of 1.2V should be used.There is no safe voltage for the SoCs wireless above 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.A system on a chip benefits from having 256 terminations.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 138 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.There are 138 inputs available on the SoC chip.Logic system on chips consist of 12084 logic cells.There is a flash of 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-1VFG256I System On Chip (SoC) applications.
- Medical
- Published Paper
- Central inverter
- Cyber security for critical applications in the aerospace
- Servo drive control module
- Body control module
- Networked sensors
- Vending machines
- Smart appliances
- AC drive control module
