M2S010-VFG256
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 days ago) |
| Package / Case | 256-LBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Frequency | 340MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 138 |
| Qualification Status | Not Qualified |
| Power Supplies | 1.2V |
| Max Supply Voltage | 3.45V |
| Min Supply Voltage | 1.14V |
| Memory Size | 256kB |
| Number of I/O | 138 |
| RAM Size | 64KB |
| Memory Type | FLASH |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Propagation Delay | 3.316 ns |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 138 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 12084 |
| Primary Attributes | FPGA - 10K Logic Modules |
| Max Junction Temperature (Tj) | 85°C |
| Flash Size | 256KB |
| Height | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 10K Logic Modules.It comes in a state-of-the-art Tray package.This SoC part contains a total of 138 I/Os in total.It is recommended to use a 1.2V power supply.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.As a result, there are 256 terminations in total, which does really benefit system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 138 outputs.A power supply of 1.2V is required.The SoC chip is equipped with 138 inputs.This flash has a size of 256KB.The wireless SoC works at a frequency of 340MHz.This SoC processor also includes LG-MIN, WD-MIN.Supply voltage is rated at 3.45V.Power is supplied to it at least in the amount of 1.14V.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-VFG256 System On Chip (SoC) applications.
- Mobile computing
- Transmitters
- Self-aware system-on-chip (SoC)
- Smart appliances
- Temperature
- Industrial automation devices
- DC-input BLDC motor drive
- Embedded systems
- String inverter
- Mouse
