Parameters |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
400 |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B400 |
Number of Outputs |
195 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
195 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
195 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 10K Logic Modules |
Number of Logic Cells |
12084 |
Flash Size |
256KB |
Height Seated (Max) |
1.51mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
400-LFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2014 |
Series |
SmartFusion®2 |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 400-LFBGA by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the SmartFusion?2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 10K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 195 I/Os.A 1.2V power supply is recommended.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.A system on a chip benefits from having 400 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.In order for this SoC chip to work properly, you can have 195 outputs.A power supply of 1.2V is required to run system on chip.Inputs are available on the SoC chip in the number of 195.System on chips of logic are comprised of 12084 logic cells.There is a flash of 256KB on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010-VFG400I System On Chip (SoC) applications.
- Automotive gateway
- Personal Computers
- Vending machines
- Industrial automation devices
- Communication interfaces ( I2C, SPI )
- POS Terminals
- Remote control
- Central inverter
- Three phase UPS
- Measurement testers