M2S010S-1FG484I

This SoC is built on ARM? Cortex?-M3 core processor(s).

There are ARM? Cortex?-M3 core processors in this SoC.Package 484-BGA is assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 10K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.233 I/Os are included in this SoC part.As for its flash size, it is 256KB.M2S010S will give you system on chips with similar specifications and purposes.The wireless SoC works at a frequency of 166MHz.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start up, -40°C is sufficient.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S010S-1FG484I System On Chip (SoC) applications.

• Communication interfaces ( I2C, SPI )
• Published Paper
• Industrial robot
• Apple smart watch
• Functional safety for critical applications in the aerospace
• Robotics
• Industrial sectors
• String inverter
• POS Terminals
• Deep learning hardware