M2S010S-1FGG484I

This SoC is built on ARM? Cortex?-M3 core processor(s).

ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 10K Logic Modules.It comes in a state-of-the-art Tray package.233 I/Os in total are included in this SoC part.It has a 256KB flash.It is possible to find system on chips that are similar in specs and purpose by searching for M2S010S.wireless SoCs operate at 166MHz.The SoC meaning is based on the core architecture of ARM.Starting the SoC computing is as simple as setting -40°C.This SoC system on chip is designed to operate at a temperature of 100°C.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S010S-1FGG484I System On Chip (SoC) applications.

• Networked sensors
• High-end PLC
• Central alarm system
• ARM
• Personal Computers
• ARM support modules
• Automotive gateway
• Automated sorting equipment
• RISC-V
• Measurement testers