Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
144-LQFP |
Supplier Device Package |
144-TQFP (20x20) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Series |
SmartFusion®2 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
84 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 10K Logic Modules |
Flash Size |
256KB |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Assigned with the package 144-LQFP, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.84 I/Os are included in this SoC part.A flashing 256KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010S-1TQG144 System On Chip (SoC) applications.
- Level
- Test and Measurement
- Special Issue Information
- Digital Media
- USB hard disk enclosure
- Robotics
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- Measurement testers
- Industrial
- Healthcare