Parameters |
Lifecycle Status |
OBSOLETE (Last Updated: 1 month ago) |
Package / Case |
144-LQFP |
Supplier Device Package |
144-TQFP (20x20) |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Series |
SmartFusion®2 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
84 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 10K Logic Modules |
Flash Size |
256KB |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 144-LQFP by its manufacturer for this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 10K Logic Modules.It is packaged in a state-of-the-art Tray package.84 I/Os are included in this SoC part.A 256KB flash can be seen on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010S-TQ144I System On Chip (SoC) applications.
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- Test and Measurement
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