M2S010T-1FG484M
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 days ago) |
| Package / Case | 484-BGA |
| Surface Mount | YES |
| Operating Temperature | -55°C~125°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| ECCN Code | 3A001.A.2.C |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B484 |
| Number of Outputs | 233 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 233 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 233 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 10K Logic Modules |
| Number of Logic Cells | 12084 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at -55°C~125°C TJ on an average.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.Housed in the state-of-art Tray package.This SoC part contains a total of 233 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.If it has at least a 1.14V volt power supply, it can work fine.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 484 terminations, so system on a chip is really aided by this.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.The SoC chip that comes with this module can be configured to have 233 outputs.System on chip requires 1.2V power supplies.This SoC chip has a total of 233 inputs that can be used.There are 12084 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010T-1FG484M System On Chip (SoC) applications.
- Central inverter
- ARM support modules
- Keyboard
- Networked sensors
- Mouse
- Sensor network-on-chip (sNoC)
- Digital Signal Processing
- Flow Sensors
- Microcontroller
- Medical
