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M2S010T-1VFG256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S010T-1VFG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 992
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 10K Logic Modules.An advanced Tray package houses this SoC system on a chip.138 I/Os are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.This SoC system on a chip can run on a power supply that is at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In total, there are 256 terminations, which makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.You can have 138 user outputs for this SoC chip.A power supply of 1.2V is required.A SoC chip with 138 inputs is available.12084 logic cells are present in logic system on chips.There is a flash of 256KB.Aside from that, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010T-1VFG256 System On Chip (SoC) applications.

  • Automotive gateway
  • Smartphones
  • Remote control
  • Medical Pressure
  • POS Terminals
  • Temperature
  • POS Terminals
  • Medical
  • Mouse
  • Networked sensors

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