Parameters |
Factory Lead Time |
1 Week |
Package / Case |
256-LBGA |
Supplier Device Package |
256-FPBGA (17x17) |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 10K Logic Modules |
Flash Size |
256KB |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines FPGA - 10K Logic Modules and that is something to note.Housed in the state-of-art Tray package.Total I/Os on this SoC part are 138.It has a 256KB flash.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010T-1VFG256I System On Chip (SoC) applications.
- Remote control
- Fitness
- Industrial transport
- Central alarm system
- Networked Media Encode/Decode
- Sports
- Mobile computing
- Automated sorting equipment
- Flow Sensors
- USB hard disk enclosure