M2S010T-FG484

This SoC is built on ARM? Cortex?-M3 core processor(s).

ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BGA to this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 10K Logic Modules.Tray package houses this SoC system on a chip.As a whole, this SoC part includes 233 I/Os.This flash has a size of 256KB.By searching M2S010T, you can find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 166MHz.In this SoC meaning, ARM serves as the core architecture.Just 0°C will start the SoC computing.There is a maximum operating temperature of 85°C set for this SoC system on chip during its design.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S010T-FG484 System On Chip (SoC) applications.

• Test and Measurement
• Industrial automation devices
• ARM support modules
• Functional safety for critical applications in the industrial sectors
• Networked sensors
• Mobile market
• Networked Media Encode/Decode
• Central alarm system
• Sports
• Smartphone accessories