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M2S010TS-1FG484

0°C~85°C TJ System On ChipSmartFusion?2 Series 233 I/O


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S010TS-1FG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 116
  • Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 233 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 233
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 10K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.233 I/Os are available in this SoC part.The flash is set to 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S010TS-1FG484 System On Chip (SoC) applications.

  • Mouse
  • RISC-V
  • Automotive
  • Industrial transport
  • Avionics
  • String inverter
  • Networked Media Encode/Decode
  • Cyberphysical system-on-chip
  • Measurement testers
  • Communication interfaces ( I2C, SPI )

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