Parameters |
Factory Lead Time |
1 Week |
Package / Case |
484-BGA |
Supplier Device Package |
484-FPBGA (23x23) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
233 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 10K Logic Modules |
Flash Size |
256KB |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.233 I/Os are available in this SoC part.The flash is set to 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-1FG484 System On Chip (SoC) applications.
- Mouse
- RISC-V
- Automotive
- Industrial transport
- Avionics
- String inverter
- Networked Media Encode/Decode
- Cyberphysical system-on-chip
- Measurement testers
- Communication interfaces ( I2C, SPI )