M2S010TS-1FGG484
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 233 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 10K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.Its package is 484-BGA.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion?2 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 10K Logic Modules.Housed in the state-of-art Tray package.This SoC part contains a total of 233 I/Os in total.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-1FGG484 System On Chip (SoC) applications.
- Industrial transport
- Self-aware system-on-chip (SoC)
- Special Issue Editors
- Industrial sectors
- Healthcare
- Wireless networking
- Smart appliances
- Vending machines
- Transmitters
- Measurement testers
