M2S010TS-1VF256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 138 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 138 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 138 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 10K Logic Modules |
| Number of Logic Cells | 12084 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.It has been assigned a package 256-LFBGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.It comes in a state-of-the-art Tray package.138 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.There is no safe voltage for the SoCs wireless above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.system on a chip benefits from 256 terminations.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.In order for this SoC chip to work properly, you can have 138 outputs.A power supply of 1.2V is required.A SoC chip with 138 inputs is available.The logic system on chips contain 12084 logic cells.This flash has a size of 256KB.Aside from that, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010TS-1VF256I System On Chip (SoC) applications.
- Keywords
- Temperature
- Medical
- Three phase UPS
- ARM support modules
- Keyboard
- CNC control
- Embedded systems
- POS Terminals
- Body control module
