Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
256-LBGA |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tray |
Series |
Automotive, AEC-Q100, SmartFusion®2 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 10K Logic Modules |
Flash Size |
256KB |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.The Automotive, AEC-Q100, SmartFusion?2 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~125°C TJ on a regular basis.This SoC security combines FPGA - 10K Logic Modules and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 138.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A flashing 256KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-1VFG256T2 System On Chip (SoC) applications.
- Robotics
- Industrial
- Mouse
- Embedded systems
- Wireless sensor networks
- Print Special Issue Flyer
- ARM support modules
- Medical
- CNC control
- Networked Media Encode/Decode