Parameters |
Factory Lead Time |
1 Week |
Package / Case |
400-LFBGA |
Supplier Device Package |
400-VFBGA (17x17) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
195 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 10K Logic Modules |
Flash Size |
256KB |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Manufacturer assigns package 400-LFBGA to this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 195 inputs and outputs.As for its flash size, it is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-1VFG400 System On Chip (SoC) applications.
- Apple smart watch
- Measurement tools
- RISC-V
- Industrial transport
- Optical drive
- Automated sorting equipment
- Robotics
- sequence controllers
- Networked sensors
- POS Terminals