Parameters |
Factory Lead Time |
1 Week |
Package / Case |
400-LFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
400 |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B400 |
Number of Outputs |
195 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
195 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
195 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 10K Logic Modules |
Number of Logic Cells |
12084 |
Flash Size |
256KB |
Height Seated (Max) |
1.51mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.According to the manufacturer, this system on a chip has a package of 400-LFBGA.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 195 I/Os.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.Power supply should be at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.Having 400 terminations in total makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.You can have 195 user outputs for this SoC chip.You will need to provide 1.2V power supplies in order to run system on chip.Inputs are available on the SoC chip in the number of 195.A logic SoC has 12084 logic cells.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-VFG400 System On Chip (SoC) applications.
- Functional safety for critical applications in the industrial sectors
- Deep learning hardware
- Three phase UPS
- ARM processors
- Personal Computers
- Industrial transport
- Communication interfaces ( I2C, SPI )
- Servo drive control module
- Industrial robot
- Smart appliances