Parameters |
Factory Lead Time |
1 Week |
Package / Case |
325-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
325 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.5mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B325 |
Number of Outputs |
180 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
180 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
180 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.01mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the SmartFusion?2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 25K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 180 inputs and outputs.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.It is really beneficial to have system on a chip since there are 325 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There are 180 outputs available on this SoC.In order to operate system on chip, you will need 1.2V power supplies.The SoC chip offers 180 inputs.A logic SoC has 27696 logic cells.A 256KB flash can be seen on it.This SoC processor also includes LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025-1FCS325I System On Chip (SoC) applications.
- Central alarm system
- Medical
- ARM support modules
- Special Issue Editors
- Microcontroller
- Sports
- Deep learning hardware
- Functional safety for critical applications in the automotive
- Networked sensors
- Industrial AC-DC