Parameters |
Factory Lead Time |
1 Week |
Package / Case |
256-LFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
138 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
138 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.The manufacturer assigns this system on a chip with a 256-LFBGA package.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The system on a chip is part of the series SmartFusion?2.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines FPGA - 25K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.Total I/Os on this SoC part are 138.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.In order to run it, it must be fed by at least 1.14V of power.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.Having 256 terminations in total makes system on a chip possible.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 138 outputs.You will need to provide 1.2V power supplies in order to run system on chip.On the SoC chip, there are 138 inputs available for use.27696 logic cells are included in logic system on chips.There is a flash of 256KB on it.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025-1VF256I System On Chip (SoC) applications.
- Sports
- Industrial Pressure
- Temperature Sensors
- Medical
- Functional safety for critical applications in the aerospace
- Sensor network-on-chip (sNoC)
- Microprocessors
- Efficient hardware for inference of neural networks
- Level
- Personal Computers