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M2S025-1VFG256I

256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S025-1VFG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 716
  • Description: 256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 25K Logic Modules.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 138 I/Os.A 1.2V power supply is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As long as it receives a power supply that is at least 1.14V, it should be able to function.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 256 terminations, which makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.There is the option to have 138 outputs on this SoC chip.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 138 inputs available for use.A logic SoC has 27696 logic cells.It has a 256KB flash.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025-1VFG256I System On Chip (SoC) applications.

  • PC peripherals
  • System-on-chip (SoC)
  • Smartphone accessories
  • Keywords
  • Robotics
  • Medical
  • Functional safety for critical applications in the aerospace
  • Networked sensors
  • Sports
  • Central alarm system

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