Parameters |
Factory Lead Time |
1 Week |
Package / Case |
256-LFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
138 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
138 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.A MCU, FPGA technique is used for the SoC design's internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.It is important to note that this SoC security combines FPGA - 25K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.In total, this SoC part has 138 I/Os.It is recommended to use a 1.2V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.There are 256 terminations in total and that really benefits system on a chip.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.A SoC chip with 138 outputs is available.A power supply of 1.2V is required to run system on chip.This SoC chip is equipped with 138 inputs for the user to choose from.There are 27696 logic cells in the logic system on chips.It has a 256KB flash.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025-VF256I System On Chip (SoC) applications.
- Smart appliances
- Automated sorting equipment
- Cyberphysical system-on-chip
- RISC-V
- Temperature
- Apple smart watch
- Functional safety for critical applications in the industrial sectors
- POS Terminals
- Industrial sectors
- String inverter