Parameters |
Factory Lead Time |
1 Week |
Package / Case |
256-LBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
138 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
138 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.One important thing to mark down is that this SoC meaning combines FPGA - 25K Logic Modules.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 138 I/Os.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 256 terminations, which makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.You can have 138 user outputs for this SoC chip.System on chip requires 1.2V power supplies.Inputs are available on the SoC chip in the number of 138.27696 logic cells are present in logic system on chips.It has a 256KB flash.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025-VFG256 System On Chip (SoC) applications.
- sequence controllers
- Industrial automation devices
- Apple smart watch
- Measurement tools
- Digital Signal Processing
- CNC control
- USB hard disk enclosure
- Microcontroller
- Wireless sensor networks
- Sports