banner_page

M2S025-VFG256I

256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S025-VFG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 272
  • Description: 256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 25K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 138 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.Power supplies of at least 1.14V are required.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.There is the option to have 138 outputs on this SoC chip.You will need to provide 1.2V power supplies in order to run system on chip.This SoC chip has a total of 138 inputs that can be used.System on chips of logic are comprised of 27696 logic cells.As for its flash size, it is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025-VFG256I System On Chip (SoC) applications.

  • Medical Pressure
  • System-on-chip (SoC)
  • Robotics
  • AC-input BLDC motor drive
  • Healthcare
  • Wireless sensor networks
  • Self-aware system-on-chip (SoC)
  • Avionics
  • Measurement tools
  • Video Imaging

Write a review

Note: HTML is not translated!
    Bad           Good