Parameters |
Factory Lead Time |
1 Week |
Package / Case |
256-LBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
138 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
138 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 25K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 138 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.Power supplies of at least 1.14V are required.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.There is the option to have 138 outputs on this SoC chip.You will need to provide 1.2V power supplies in order to run system on chip.This SoC chip has a total of 138 inputs that can be used.System on chips of logic are comprised of 27696 logic cells.As for its flash size, it is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025-VFG256I System On Chip (SoC) applications.
- Medical Pressure
- System-on-chip (SoC)
- Robotics
- AC-input BLDC motor drive
- Healthcare
- Wireless sensor networks
- Self-aware system-on-chip (SoC)
- Avionics
- Measurement tools
- Video Imaging