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M2S025T-1FCSG325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S025T-1FCSG325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 995
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 325-TFBGA, CSPBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 25K Logic Modules and that is something to note.Housed in the state-of-art Tray package.In total, this SoC part has 180 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.This SoC system on a chip can run on a power supply that is at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 325 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.There are 180 outputs available on this SoC.As far as power supplies are concerned, system on chip requires 1.2V.There are 180 inputs available on the SoC chip.Logic system on chips features 27696 logic cells.As for its flash size, it is 256KB.Additionally, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025T-1FCSG325 System On Chip (SoC) applications.

  • Mobile computing
  • Personal Computers
  • Servo drive control module
  • Avionics
  • RISC-V
  • Measurement testers
  • Healthcare
  • Test and Measurement
  • Digital Signal Processing
  • Apple smart watch

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