Parameters |
Factory Lead Time |
1 Week |
Package / Case |
325-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
325 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B325 |
Number of Outputs |
180 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
180 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
180 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.01mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 325-TFBGA, CSPBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 25K Logic Modules and that is something to note.Housed in the state-of-art Tray package.In total, this SoC part has 180 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.This SoC system on a chip can run on a power supply that is at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 325 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.There are 180 outputs available on this SoC.As far as power supplies are concerned, system on chip requires 1.2V.There are 180 inputs available on the SoC chip.Logic system on chips features 27696 logic cells.As for its flash size, it is 256KB.Additionally, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-1FCSG325 System On Chip (SoC) applications.
- Mobile computing
- Personal Computers
- Servo drive control module
- Avionics
- RISC-V
- Measurement testers
- Healthcare
- Test and Measurement
- Digital Signal Processing
- Apple smart watch