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M2S025T-1FCSG325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S025T-1FCSG325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 792
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

Details

Tags

Parameters
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status RoHS Compliant
Factory Lead Time 1 Week
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 25K Logic Modules.It comes in a state-of-the-art Tray package.180 I/Os in total are included in this SoC part.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 325 terminations, so system on a chip is really aided by this.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip like this can have 180 outputs.There is 1.2V power supply requirement for this system on chip SoC.On the SoC chip, there are 180 inputs available for use.27696 logic cells are present in logic system on chips.As for its flash size, it is 256KB.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S025T-1FCSG325I System On Chip (SoC) applications.

  • PC peripherals
  • Digital Media
  • Communication network-on-Chip (cNoC)
  • Efficient hardware for training of neural networks
  • Level
  • Body control module
  • Networked Media Encode/Decode
  • POS Terminals
  • Industrial automation devices
  • Networked sensors

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