Parameters |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.01mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
Non-RoHS Compliant |
Factory Lead Time |
1 Week |
Package / Case |
325-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
325 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.5mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B325 |
Number of Outputs |
180 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
180 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
180 |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.This SoC security combines FPGA - 25K Logic Modules and that is something to note.Housed in the state-of-art Tray package.This SoC part contains a total of 180 I/Os in total.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supply should be at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 325 terminations, which makes system on a chip possible.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.In order for this SoC chip to work properly, you can have 180 outputs.This system on chip SoC requires 1.2V power supply at all.180 inputs are available on the SoC chip.There are 27696 logic cells in the logic system on chips.There is a flash of 256KB on it.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-FCS325 System On Chip (SoC) applications.
- Deep learning hardware
- Sports
- Mobile computing
- Automotive gateway
- Smart appliances
- External USB hard disk/SSD
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