Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
256-LBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
138 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
138 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.A key point to note is that this SoC security combines FPGA - 25K Logic Modules.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 138 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supply should be at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.A system on a chip benefits from having 256 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 138 outputs is available.You will need to provide 1.2V power supplies in order to run system on chip.The SoC chip offers 138 inputs.A logic SoC has 27696 logic cells.The flash is set to 256KB.Additionally, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-VFG256I System On Chip (SoC) applications.
- Embedded systems
- Robotics
- Industrial transport
- Vending machines
- Industrial automation devices
- External USB hard disk/SSD
- Microcontroller based SoC ( RISC-V, ARM)
- Communication interfaces ( I2C, SPI )
- Medical Pressure
- Remote control