Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
325-TFBGA, CSPBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
325 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B325 |
Number of Outputs |
180 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
180 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
180 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.01mm |
Length |
11mm |
Width |
11mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 25K Logic Modules together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.180 I/Os in total are included in this SoC part.A power supply with a 1.2V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.If it has at least a 1.14V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.It is really beneficial to have system on a chip since there are 325 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip with 180 outputs is available.As far as power supplies are concerned, system on chip requires 1.2V.On the SoC chip, there are 180 inputs available for use.Logic system on chips features 27696 logic cells.The flash size of the SoC meaning is 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025TS-1FCSG325I System On Chip (SoC) applications.
- Automotive
- Central inverter
- Industrial automation devices
- Self-aware system-on-chip (SoC)
- Wireless sensor networks
- Sensor network-on-chip (sNoC)
- Keywords
- Keyboard
- Transmitters
- Industrial transport