M2S025TS-1VFG400
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 400-LFBGA |
| Supplier Device Package | 400-VFBGA (17x17) |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 207 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 25K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.There is a 400-LFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 25K Logic Modules, an important feature to keep in mind.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 207 I/Os.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S025TS-1VFG400 System On Chip (SoC) applications.
- Fitness
- ARM support modules
- DC-input BLDC motor drive
- Wireless sensor networks
- Vending machines
- POS Terminals
- Communication interfaces ( I2C, SPI )
- Networked sensors
- Avionics
- Cyber security for critical applications in the aerospace
