M2S025TS-FCS325I
| Parameters | |
|---|---|
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 25K Logic Modules |
| Number of Logic Cells | 27696 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 25K Logic Modules.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 180 inputs and outputs.It is recommended to use a 1.2V power supply.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.There are 325 terminations in total and that really benefits system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 180 outputs.A power supply of 1.2V is required to run system on chip.There are 180 inputs available on the SoC chip.There are 27696 logic cells in the logic system on chips.This flash has a size of 256KB.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025TS-FCS325I System On Chip (SoC) applications.
- ARM Cortex M4 microcontroller
- Communication interfaces ( I2C, SPI )
- Functional safety for critical applications in the automotive
- Microprocessors
- Microcontroller
- Medical Pressure
- Industrial robot
- DC-input BLDC motor drive
- Sensor network-on-chip (sNoC)
- USB hard disk enclosure
