Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
400-LFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
400 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B400 |
Number of Outputs |
207 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
207 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
207 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.51mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 400-LFBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides users with reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.In total, this SoC part has 207 I/Os.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 400 terminations, so system on a chip is really aided by this.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There is the option to have 207 outputs on this SoC chip.A power supply of 1.2V is required.A SoC chip with 207 inputs is available to the user.Logic system on chips features 27696 logic cells.There is a flash of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S025TS-VF400I System On Chip (SoC) applications.
- USB hard disk enclosure
- RISC-V
- Automated sorting equipment
- Deep learning hardware
- Optical drive
- AC drive control module
- Keywords
- Functional safety for critical applications in the aerospace
- Central inverter
- Industrial automation devices