Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
256-LBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
138 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
138 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 25K Logic Modules together.A state-of-the-art Tray package houses this SoC system on a chip.138 I/Os in total are included in this SoC part.A 1.2V power supply is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.In order for this SoC chip to work properly, you can have 138 outputs.There is 1.2V power supply requirement for this system on chip SoC.On the SoC chip, there are 138 inputs available for use.System on chips of logic are comprised of 27696 logic cells.A 256KB flash can be seen on it.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025TS-VFG256 System On Chip (SoC) applications.
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