M2S050-1FCS325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 50K Logic Modules |
| Number of Logic Cells | 56340 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.One important thing to mark down is that this SoC meaning combines FPGA - 50K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.200 I/Os in total are included in this SoC part.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supplies of at least 1.14V are required.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.A system on a chip benefits from having 325 terminations.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 200 outputs, which is convenient.In order to use system on chip, you will need a power supply of 1.2V.200 inputs are available on the SoC chip.56340 logic cells are included in logic system on chips.The flash is set to 256KB.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-1FCS325 System On Chip (SoC) applications.
- sequence controllers
- Microprocessors
- Samsung galaxy gear
- Fitness
- Cyber security for critical applications in the aerospace
- Print Special Issue Flyer
- Industrial
- Defense
- Published Paper
- Industrial AC-DC
