M2S050-1FCS325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 50K Logic Modules |
| Number of Logic Cells | 56340 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 200 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.A system on a chip benefits from having 325 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 200 outputs.As far as power supplies are concerned, system on chip requires 1.2V.A SoC chip with 200 inputs is available.56340 logic cells are included in logic system on chips.This flash has a size of 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-1FCS325I System On Chip (SoC) applications.
- Temperature Sensors
- Mobile computing
- Industrial robot
- Vending machines
- Communication interfaces ( I2C, SPI )
- Medical
- Measurement testers
- Personal Computers
- Industrial automation devices
- Body control module
