M2S050S-1FGG484I
| Parameters | |
|---|---|
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | SmartFusion®2 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Frequency | 166MHz |
| Base Part Number | M2S050S |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 267 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 50K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines FPGA - 50K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 267.It has a 256KB flash.Search M2S050S for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.Starting the SoC computing is as simple as setting -40°C.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S050S-1FGG484I System On Chip (SoC) applications.
- Automated sorting equipment
- Video Imaging
- Functional safety for critical applications in the automotive
- Cyberphysical system-on-chip
- Smart appliances
- AC-input BLDC motor drive
- Three phase UPS
- Avionics
- Automotive
- Temperature Sensors
