M2S050T-FCSG325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 50K Logic Modules |
| Number of Logic Cells | 56340 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 200 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.In the SoCs wireless, voltages above 1.26V are considered unsafe.Power supply should be at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.There are 325 terminations in total and that really benefits system on a chip.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 200 outputs is available.As far as power supplies are concerned, system on chip requires 1.2V.This SoC chip has a total of 200 inputs that can be used.56340 logic cells are included in logic system on chips.The flash is set to 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050T-FCSG325 System On Chip (SoC) applications.
- ARM support modules
- Industrial automation devices
- Industrial sectors
- Mouse
- Industrial
- Mobile market
- AC-input BLDC motor drive
- Digital Signal Processing
- Optical drive
- Personal Computers
