M2S050T-FGG896ES

This SoC is built on ARM? Cortex?-M3 core processor(s).

ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Its package is 896-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.377 I/Os in total are included in this SoC part.There is a flash of 256KB.M2S050 will give you system on chips with similar specifications and purposes.wireless SoCs operate at 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.In order for the SoC computing to start, 0°C is just about right.85°C is the designing maximum operating temperature of this SoC system on chip.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S050T-FGG896ES System On Chip (SoC) applications.

• Functional safety for critical applications in the automotive
• PC peripherals
• Fitness
• Industrial transport
• AC drive control module
• Keywords
• Digital Media
• Industrial sectors
• sequence controllers
• Level