Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
-55°C~125°C TJ |
Packaging |
Tray |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
ECCN Code |
3A001.A.2.C |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
267 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
267 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
267 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 50K Logic Modules |
Number of Logic Cells |
56340 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 484-BGA package.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -55°C~125°C TJ.There is one thing to note about this SoC security: it combines FPGA - 50K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 267 I/Os in total.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.At least 1.14V can be supplied as a power source.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 484 terminations in total and that really benefits system on a chip.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip with 267 outputs is available.System on chip requires 1.2V power supplies.This SoC chip is equipped with 267 inputs for the user to choose from.Logic system on chips consist of 56340 logic cells.There is a flash of 256KB on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050TS-1FGG484M System On Chip (SoC) applications.
- Central alarm system
- Industrial automation devices
- Functional safety for critical applications in the aerospace
- Special Issue Information
- Level
- Wireless sensor networks
- High-end PLC
- Healthcare
- AC drive control module
- Industrial automation devices